Utilization of die active surfaces for laterally extending die internal and external connections

ABSTRACT

The formation of routing traces on an external surface of a semiconductor device, such as a flip-chip, which has a plurality of ball or bump sites patterned in specific locations, wherein the ball or bump sites are in electrical communication with external communication traces which are used to route signals from the flip-chip integrated circuitry. Such external communication traces generally result in unused space on the exterior surface of the flip-chip. This unused space can be utilized for forming routing traces to connect portions of the internal circuitry of the flip-chip rather than forming such routing traces internally, for forming routing traces to connect two or more semiconductor dice, or for forming routing traces for use as repair mechanisms.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation of application Ser. No. 09/599,752, filed Jun. 22, 2000, which is a continuation of application Ser. No. 09/287,456, filed Apr. 7, 1999, now U.S. Pat. 6,124,195, issued Sep. 26, 2000, which is a divisional of application Ser. No. 09/229,373, filed Jan. 13, 1999, now U.S. Pat. 6,078,100, issued Jun. 20, 2000.

BACKGROUND OF THE INVENTION

[0002] Field of the Invention: The present invention relates to trace formation in the fabrication of semiconductor devices. More particularly, the present invention relates to the formation of routing traces on an external surface of a semiconductor device.

[0003] State of the Art: Integrated circuit (“IC”) devices generally consist of a plurality of components (such as resistors, capacitors, diodes, transistors, fuses, conductors, and the like) fabricated on a single semiconductor chip. Each of these components is electrically isolated from one another by dielectric materials. Thus, in order to interact with one another to form an integrated circuit, a plurality conductive interconnections (hereinafter “traces”) must be formed between the components.

[0004]FIG. 10 illustrates an exemplary trace configuration connecting a pair of pinch resistors 202A and 202B in series in an IC device. First and second pinch resistors 202A and 202B, respectively, are formed in a p-type substrate 206 by doping n-type regions 208A and 208B, respectively, into the p-type substrate 206. P-type regions 214A and 214B, respectively, are doped into the n-type regions 208A and 208B to reduce the cross-sectional area of the resistor, thereby increasing its respective resistance. A first trace 218A is disposed atop a dielectric layer 222 and routes an electric current to the first pinch resistor 202A through a first contact 224A through the dielectric layer 222. The electric current travels through the first pinch resistor 202A and through a second contact 224B through the dielectric layer 222. A second trace 218B is disposed atop the dielectric layer 222 and is in electrical contact with the second contact 224B. The second trace 218B routes the electric current to the second pinch resistor 202B by a third contact 224C through the dielectric layer 222. The electric current travels through the second pinch resistor 202B and exits through a fourth contact 224D through the dielectric layer 222. A third trace 218C is disposed atop the dielectric layer 222 and is in electrical contact with the fourth contact 224D to route the electric current to other components in the IC device.

[0005] Higher performance, lower cost, increased miniaturization of the components comprising the IC devices, and greater packaging density of IC devices are ongoing goals of the computer industry. The advantages of increased miniaturization of components include: reduced-bulk electronic equipment, improved reliability by reducing the number of solder or plug connections, lower assembly and packaging costs, and improved circuit performance. In pursuit of increased miniaturization, IC devices have been continually redesigned to achieved ever-higher degrees of integration which has reduced the size of the IC device. However, as the dimensions of the IC devices are reduced, the geometry of the components and circuit elements has also decreased. Moreover, as components become smaller and smaller, tolerances for all semiconductor structures (such as circuitry traces, contacts, dielectric thickness, and the like) become more and more stringent. Although the reduction in size creates technical problems, the future advancement of the technology requires such size reductions.

[0006] Of course, the reduction in component size and density packing (smaller component-to-component spacing) of the components in the IC devices has resulted in a greatly reduced area for running traces to interconnect the components. Furthermore, the integration and densification process in IC devices has caused the continuous migration of traces and connections, which were previously routed on printed circuit boards, cards, and modules, to the IC device itself, yet further reducing potential area for forming traces. Thus, multilevel metallization has become a technique to cope with the reduced area. Multilevel metallization is a technique of forming traces on different layers of dielectric material over the components. FIG. 11 illustrates an exemplary four-tier metallization structure 240. The metallization structure 240 shows an active area 242 formed in a semiconductor substrate 244 which is in electrical communication with a first level trace 246A, such as aluminum, tungsten, titanium, or various alloys thereof. The first level trace 246A is disposed over a first level barrier layer 248A, such as a silicon nitride layer, which is over the semiconductor substrate 244. A first level dielectric layer 252A is disposed over the first level trace 246A and the exposed first level barrier layer 248A. A second level barrier layer 248B is disposed over the first level dielectric layer 252A and a second level trace 246B is formed on the second level barrier layer 248B. The first level trace 246A and the second level trace 246B are in electrical communication through a first-to-second level contact 258A which extends through the first level dielectric layer 252A and the second level barrier layer 248B.

[0007] A second level dielectric layer 252B is disposed over the second level trace 246B and the exposed second level barrier layer 258A. A third level barrier layer 248C is disposed over the second level dielectric layer 252B and a third level trace 246C is formed on the third level barrier layer 248C. The second level trace 246B and the third level trace 246C are in electrical communication through a second-to-third level contact 258B which extends through the second level dielectric layer 252B and the third level barrier layer 248C.

[0008] A third level dielectric layer 252C is disposed over the third level trace 246C and the exposed third level barrier layer 258B. A fourth level barrier layer 248D is disposed over the third level dielectric layer 252C and a fourth level trace 246D is formed on the fourth level barrier layer 248D. The third level trace 246C and the fourth level trace 246D are in electrical communication through a third-to-fourth level contact 258C which extends through the third level dielectric layer 252C and the fourth level barrier layer 248D.

[0009] A fourth level dielectric layer 252D is disposed over the fourth level trace 246D and the exposed fourth level barrier layer 258C. The upper surface 284 of the fourth level dielectric layer 252D is used to form bond pads 286 in specific locations and external communication traces 288 conduct input/output signals to solder balls 292. The solder balls 292 will be connected to external devices, such as a printed circuit board, to relay input/output signals therebetween.

[0010]FIG. 12 is a top view of the metallization structure 240 of FIG. 11 prior to the addition of solder balls 292. As FIG. 12 illustrates, the bond pads 286 are patterned in specific locations for active surface-down mounting to contact sites of metal conductors of a carrier substrate (not shown), such as a printed circuit board, FR4, or the like, wherein the contact sites are a mirror-image of the bond pads 286 pattern on the metallization structure 240. It is, of course, understood that although the bond pads 286 are illustrated as substantially square, they can be of any shape, including round, as shown as round bond pad 294.

[0011] Although multilayer metallization is effective in compensating for reduced areas for trace patterning, the thickness of the IC device is also a concern. Therefore, it can be appreciated that it would be advantageous to develop a technique which would maximize the available area on an IC device for patterning traces for the interconnection of IC device components, without adding additional layers to the multilayer structure.

BRIEF SUMMARY OF THE INVENTION

[0012] The present invention relates to the formation of routing traces on an external surface of a semiconductor device. In an exemplary method of the present invention, a flip-chip is provided which has an active surface bearing a plurality of bonds pads upon which minute solder balls or other conductive material elements are to be disposed. The bond pads are patterned in specific locations for active surface-down mounting to contact sites of metal conductors of a carrier substrate, such as a printed circuit board, wherein the contact sites are a mirror-image of the bond pad pattern on the flip-chip. The bond pads are in electrical communication with external communication traces which are used to route signals from the flip-chip integrated circuitry. Such external communication traces generally result in unused space on the exterior surface of the flip-chip. This unused space can be utilized for forming routing traces for the internal circuitry of the flip-chip rather than forming such routing traces internally.

[0013] Another embodiment of the present invention comprises using routing traces to connect two or more substantially adjacent semiconductor dice. A first semiconductor die and a second semiconductor die are placed in one or more recesses in a semiconductor carrier. The first semiconductor die and the second semiconductor die are substantially flush with a top surface of the semiconductor carrier. An appropriate filler material is utilized to fill any gaps between the walls of the recesses and the semiconductor dice placed therein. The filler material may be usually planarized to be substantially flush with the first and second semiconductor dice, and the semiconductor carrier top surface. With such a configuration, routing traces can be patterned over the surfaces of the semiconductor carrier and the filler material to interconnect the first and second semiconductor dice.

[0014] Yet another embodiment of the present invention comprises using routing traces as repair mechanisms. A series of routing traces can be used as deactivation mechanisms on a semiconductor device. When a defective portion of a semiconductor device is detected during a testing procedure, a routing trace can be physically severed to deactivate the defective portion. With some applications, the deactivation will result in the activation of a redundant circuit to take over for the defective circuit. In other applications, the deactivation of a defective portion of a semiconductor device will simply deactivate the defective portion of the semiconductor device.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0015] While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention can be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings in which:

[0016]FIG. 1 is a top plan view of an active surface of a prior art flip-chip;

[0017]FIG. 2 is a side cross-sectional view of the prior art flip-chip along line 2-2 of FIG. 1;

[0018]FIG. 3 is a top plan view of a flip-chip which has its active surface utilized as an addition layer for routing traces for the circuitry within the flip-chip according to the present invention;

[0019]FIGS. 4a and 4 b are side cross-sectional views of two embodiments of routing traces along line 4-4 in FIG. 3 according to the present invention;

[0020]FIG. 5 is a top plan view of two flip-chips interconnected with routing traces according to the present invention;

[0021]FIG. 6 is a side cross-sectional view of a routing trace along line 6-6 of FIG. 5 according to the present invention;

[0022]FIG. 7 is a top plan view of two flip-chips interconnected with routing traces according to the present invention;

[0023]FIG. 8 is a side cross-sectional view of a routing trace along line 8-8 of FIG. 7 according to the present invention;

[0024]FIG. 9 is a top plan view of routing traces utilized as deactivation mechanisms according to the present invention;

[0025]FIG. 10 is a side cross-sectional view of a prior art pinched resistor pair;

[0026]FIG. 11 is a side cross-sectional view of a prior art metallization structure; and

[0027]FIG. 12 is a top plan view of the prior art metallization structure of FIG. 10.

DETAILED DESCRIPTION OF THE INVENTION

[0028] FIGS. 1-9 illustrate various trace configurations on a contact surface of a semiconductor device according to the present invention. It should be understood that the illustrations are not meant to be actual views of any particular semiconductor IC device, but are merely idealized representations which are employed to more clearly and fully depict the present invention than would otherwise be possible. Additionally, elements and features common to FIGS. 1-9 retain the same numerical designation.

[0029]FIG. 1 shows a top plan view of an active surface 102 for a flip-chip 100. The active surface 102 includes a plurality of ball or bump sites 104 upon which minute solder balls or other conductive material elements (not shown) are to be disposed. The ball or bump sites 104 are patterned in specific locations for active surface-down mounting to contact sites of metal conductors of a carrier substrate (not shown), such as a printed circuit board, wherein the contact sites are a mirror-image of the ball or bump sites 104 pattern on the flip-chip 100. The ball or bump sites 104 are in electrical communication with external communication traces 106 which are used to route power to and signals to and from the flip-chip 100 integrated circuitry (not shown—i.e., below the active surface 102). It is, of course, understood that although the ball or bump sites 104 are illustrated as substantially square, they may be of any shape, including round, as shown as round ball site 108.

[0030]FIG. 2 shows a side cross-sectional view along line 2-2 of FIG. 1 which shows a contact 112 making an electrical connection between the external communication trace 106 and an internal trace 114 within the flip-chip 100. Although FIG. 1 shows all of the external communication traces 106 routing from contacts 112 (see FIG. 2) which are about peripheral edges 116 of the flip-chip 100, it is understood that each contact 112 (see FIG. 2) could be positioned anywhere to extend through to the active surface 102 of the flip-chip 100.

[0031] Referring again to FIG. 1, it can be seen that a majority of the area of the active surface 102 is not used in positioning the ball or bump sites 104 with the external communication traces 106. Thus, these unused areas are utilized as an additional surface for routing traces for the circuitry within the flip-chip 100. FIG. 3 illustrates three such routing traces: a first routing trace 122, a second routing trace 124, and a third routing trace 126. It is, of course, understood that the routing trace (e.g., 122, 124, and 126) can be considerably smaller (thinner in width and/or height) than the external communication traces 106, since the routing traces generally require substantially less current than the external communication traces 106. External communication traces 106 route power to and signals to and from an external device (not shown) which, for output signals, requires amplifying the original signal within the semiconductor device to a sufficiently strong signal for external communication. The ball or bump sites 104, the external communication traces 106, and the routing traces 122, 124, and 126 may be formed in separate steps or simultaneously formed by various methods, including, but not limited to:

[0032] 1) Coating the semiconductor die active surface 102 with a metal, such as aluminum, copper, gold, silver, and alloys thereof, forming a mask with a photoresist by exposing the photoresist to react it in a specific pattern, washing the unreacted photoresist off of the semiconductor die active surface, and etching the metal through the photoresist, thereby forming the ball or bump sites 104, the external communication traces 106, and the routing traces 122, 124, and 126;

[0033] 2) Coating the semiconductor die active surface 102 with a conductive photopolymer, exposing the photopolymer to react it in a specific pattern, and washing the unreacted photopolymer, thereby forming the ball or bump sites 104, the external communication traces 106, and the routing traces 122, 124, and 126; and

[0034] 3) Screen printing conductive or conductor-carrying polymer on the semiconductor die active surface 102, thereby forming the ball or bump sites 104, the external communication traces 106, and the routing traces 122, 124, and 126.

[0035] The first routing trace 122 is an example of a short “jumping” trace. Referring to FIGS. 4A-4B, the path for connecting first internal trace 132A with second internal trace 132C is blocked by a lateral trace 132B which is running perpendicular to the plane of the cross-section on a fourth level 138 of the multilevel structure of the flip-chip 100. A first internal trace-to-first trace contact 142A is formed to connect the first internal trace 132A with the first routing trace 122 and a first trace-to-second internal trace contact 142B is formed to connect the first routing trace 122 with the second internal trace 132C, thereby “jumping” the lateral trace 132B.

[0036] The second routing trace 124 (FIG. 3) extends substantially the length of the flip-chip 100. Such a routing trace is very advantageous for components in electrical communication with one another, but which are widely spaced from one another. If such a routing trace were not available, the components could be connected internally, which would likely require a lengthy, serpentine route shifting from layer to layer in the multilayer structure of the flip-chip 100. The direct route of the second routing trace 124 greatly reduces the overall length of the trace, thereby decreasing the time required for signals to travel between the components, and reduces the capacitance due to a reduction of the amount of metal required. The third routing trace 126 illustrates that the routing traces can be patterned to “snake” around the ball or bump sites 104 and external communication traces 106.

[0037] Another embodiment of the present invention comprises using routing traces to connect two or more semiconductor dice, as illustrated in FIGS. 5 and 6. FIG. 5 illustrates a first semiconductor die 152 and a second semiconductor die 152B placed in separate recesses in a semiconductor carrier 156. The semiconductor carrier 156 can be made of silicon, ceramic material, or even metal with a surface of insulative material etched to form recesses having sloped walls. However, the semiconductor carrier 156 should have a coefficient of thermal expansion (CTE) which is similar to the CTE of the semiconductor dice and filler, so that the heat expansion and contraction does not break the routing traces.

[0038] As shown in FIG. 6 (a cross-sectional view of FIG. 5 along line 6-6), the first semiconductor die 152 and the second semiconductor die 152B are substantially flush with a top surface 160 of the semiconductor carrier 156. An appropriate filler material 158, such as “filled” epoxies or silicones, is utilized to fill any gaps in the recess. The filler material 158 is preferably planarized to be substantially flush with the first and second semiconductor dice 152 and 152B, and the semiconductor carrier top surface 160. However, if the filler material 158 is planarized, the ball or bump sites, the external communication traces, and the routing traces must be formed thereafter. With such a configuration, routing traces 162 can be patterned to interconnect the first and second semiconductor dice 152 and 152B.

[0039] Yet another embodiment of the present invention comprises using routing traces to connect two or more semiconductor dice, as illustrated in FIGS. 7 and 8. FIG. 7 illustrates the first semiconductor die 152 and a second semiconductor die 154 placed in a single recess in a semiconductor carrier 156, wherein the first semiconductor die 152 and the second semiconductor die 154 abut one another. As shown in FIG. 8 (a cross-sectional view of FIG. 7 along line 8-8), the first semiconductor die 152A and the second semiconductor die 152B are substantially flush with a top surface 160 of the semiconductor carrier 156. An appropriate filler material 158 is utilized to fill any gaps in the recess. The filler material 158 is usually planarized to be substantially flush with the first and second semiconductor dice 152A and 152B, and the semiconductor carrier top surface 160. With such a configuration, routing traces 162 can be patterned to interconnect the first and second semiconductor dice 152A and 152B. An insulative spacer (not shown) may be disposed between the first and second semiconductor dice 152A and 152B to prevent shorting therebetween.

[0040] The embodiments illustrated in FIGS. 5-8 considerably simplify intersemiconductor dice communication. Previously, if inter-semiconductor dice communication was required, a signal from the first semiconductor die would have to be amplified and sent from an interconnection out of the first semiconductor die and through a external communication trace to a bond pad. The bond pad would be connected to a carrier substrate, such as a printed circuit board, FR4, or the like, with a solder ball, conductive epoxy pillar, or the like. The carrier substrate would, in turn, route the signal through a trace to a solder ball connected to a bond pad on a second semiconductor device. The signal would then be directed by an external communication trace to an interconnection into the second semiconductor device. This embodiment reduces or may eliminate any requirement for signal amplification and the necessity of using the valuable space which would be required by the additional external communication traces and bond pads on both the first and second semiconductor dice, as well as the additional trace on the external carrier substrate. Furthermore, this embodiment allows for faster transmission of signals between the two semiconductor dice and reduces capacitance by reducing the amount of metal required to form the connections. This embodiment also eliminates the use of an interposer board with yet another set of solder balls to a higher level carrier.

[0041] Yet another embodiment of the present invention comprises using routing traces as repair mechanisms. As shown in FIG. 9, a series of traces 172 a-d can be used as deactivation mechanisms on a semiconductor device 170. When a defective portion of a semiconductor device is detected during a testing procedure, a trace (shown as trace 172 d) can be physically severed to deactivation the defective portion. With some applications, this deactivation will result in the activation of a redundant circuit to take over for the defective circuit. In other applications, this deactivation of a defective portion of a semiconductor device will simply deactivate the defective portion of the semiconductor device. For example, in a memory chip, this deactivation will result in isolation of defective storage capacity on the memory chip.

[0042] Prior art fuses are programming devices which are blown by a tester to isolate area on a chip. However, blowing these fuses can cause damage to the chip. The repair mechanisms shown in FIG. 9 function to isolate a short or a latched-up area without risking damage to the chip.

[0043] Having thus described in detail preferred embodiments of the present invention, it is to be understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description as many apparent variations thereof are possible without departing from the spirit or scope thereof. 

What is claimed is:
 1. A flip-chip, comprising: a semiconductor chip including at least one active surface having internal circuitry thereunder; a plurality of spaced apart bump sites over said at least one active surface for directing signals between said internal circuitry of said semiconductor chip and at least one other component external to said semiconductor chip; at least one routing trace carried over an area of said at least one active surface unoccupied by said bump sites to connect a first internal circuit component to a second internal circuit component of said semiconductor chip; and electrically conductive bumps on at least some of said plurality of spaced apart bump sites.
 2. The flip-chip of claim 1, wherein said area of said at least one active surface unoccupied by said bump sites comprises an area extending substantially an entire length of said semiconductor chip.
 3. The flip-chip of claim 1, wherein at least one of said at least one routing trace is configured to interconnect at least two otherwise electrically isolated internal circuitry components of said semiconductor chip.
 4. The flip-chip of claim 3, wherein said at least two otherwise electrically isolated internal circuitry components lie substantially within the same plane, and further comprising a third internal circuitry component disposed between said at least two otherwise electrically isolated internal circuitry components.
 5. The flip-chip of claim 1, wherein at least one of said at least one routing trace is a component of a first circuit of said internal circuitry, and wherein said first circuit is redundant with at least one second circuit of said internal circuitry.
 6. The flip-chip of claim 5, wherein said at least one second circuit of said internal circuitry is configured to be activated when said at least one of said at least one routing trace is severed.
 7. The flip-chip of claim 5, wherein said at least one second circuit of said internal circuitry is configured to be deactivated when said at least one of said at least one routing trace is severed.
 8. The flip-chip of claim 1, wherein said semiconductor chip is configured as a memory chip.
 9. A flip-chip, comprising: a semiconductor chip including at least one active surface having internal circuitry thereunder; a plurality of spaced apart bump sites over said at least one active surface for directing signals between said internal circuitry of said semiconductor chip and at least one other component external to said semiconductor chip; at least one routing trace carried over an area of said at least one active surface unoccupied by said bump sites, said at least one routing trace comprising a repair mechanism; and electrically conductive bumps on at least some of said plurality of spaced apart bump sites.
 10. The flip-chip of claim 9, wherein said repair mechanism is configured to be operable by severance of said at least one routing trace to activate a selected internal circuit in said semiconductor chip.
 11. The flip-chip of claim 10, wherein said at least one routing trace is a component of a first circuit of said internal circuitry, and wherein said first circuit is redundant with said selected internal circuit.
 12. The flip-chip of claim 9, wherein said repair mechanism is configured to be operable by severance of said at least one routing trace to deactivate a selected internal circuit in said semiconductor chip.
 13. The flip-chip of claim 12, wherein said at least one routing trace is a component of a first circuit of said internal circuitry, and wherein said first circuit is redundant with said selected internal circuit.
 14. The flip-chip of claim 9, wherein said semiconductor chip is configured as a memory chip.
 15. A flip-chip, comprising: a semiconductor chip including at least one active surface having internal circuitry thereunder; a plurality of spaced apart bump sites over said at least one active surface for directing signals between said internal circuitry of said semiconductor chip and at least one other component external to said semiconductor chip; at least one routing trace carried over an area of said at least one active surface and lying within a same plane as said bump sites and laterally spaced therefrom, said at least one routing trace connecting a first internal circuit component to a second internal circuit component of said semiconductor chip; and electrically conductive bumps on at least some of said plurality of spaced apart bump sites.
 16. The flip-chip of claim 15, wherein said area of said at least one active surface lying within the same plane as said plurality of spaced apart bump sites comprises an area extending substantially an entire length of said semiconductor chip.
 17. The flip-chip of claim 15, wherein at least one of said at least one routing trace is configured to interconnect at least two otherwise electrically isolated internal circuitry components of said semiconductor chip.
 18. The flip-chip of claim 17, wherein said at least two otherwise electrically isolated internal circuitry components lie substantially within the same plane, and further comprising a third internal circuitry component disposed between said at least two otherwise electrically isolated internal circuitry components.
 19. The flip-chip of claim 15, wherein said at least one routing trace is configured as a repair mechanism, said repair mechanism adapted to be operable by severance of said at least one routing trace to activate a selected internal circuit in said semiconductor chip.
 20. The flip-chip of claim 15, wherein said at least one routing trace is configured to be a repair mechanism, said repair mechanism adapted to be operable by severance of said at least one routing trace to deactivate a selected internal circuit in said semiconductor.
 21. A semiconductor device, comprising: a plurality of semiconductor chips each having at least one active surface; a plurality of spaced apart bump sites over said at least one active surface of each semiconductor chip of said plurality for directing signals between said internal circuitry of a respective said semiconductor chip and at least one other external component; at least one routing trace on an area of said active surface unoccupied by said bump sites of one of said plurality of semiconductor chips and extending to an area of said active surface unoccupied by said bump sites of another of said plurality of semiconductor chips to effect an electrical connection between at least one internal circuit component of said one of said plurality of semiconductor chips and at least one internal circuit component of said another of said plurality of semiconductor chips.
 22. The semiconductor device of claim 21, further including: a carrier having a surface with at least one recess therein to receive said plurality of semiconductor chips, wherein said at least one recess allows substantial alignment of said upper surface of said carrier with said active surfaces of said plurality of semiconductor chips.
 23. The semiconductor device of claim 22, further including: a filler material disposed in gaps between walls of each of said recess and each of said plurality of semiconductor chips disposed therein.
 24. The semiconductor device of claim 22, wherein said carrier includes a plurality of recesses.
 25. A semiconductor device, comprising: a semiconductor chip having at least one active surface; a plurality of spaced apart bump sites on said semiconductor chip active surface for directing signals between internal circuitry of said semiconductor chip and at least one external component; at least one routing trace, extending between two circuit portions of said semiconductor chip, on an area of said active surface unoccupied by said bump sites, wherein said at least one routing trace comprises a repair mechanism.
 26. The semiconductor device of claim 25, wherein said repair mechanism is configured to be operable by severance of said at least one routing trace to activate a selected internal circuit in said semiconductor chip.
 27. The semiconductor device of claim 26, wherein said repair mechanism is configured to be operable by severance of said at least one routing trace to deactivate a selected internal circuit in said semiconductor chip.
 28. A semiconductor device, comprising: a semiconductor chip having at least one active surface; a plurality of spaced apart bump sites within a plane over on said semiconductor chip active surface, wherein each of said bump sites is adapted to direct signals between internal circuitry of said semiconductor chip and at least one external component; and at least one routing trace carried over an area of said active surface and lying within the same plane as said bump sites and laterally spaced therefrom, said routing trace connecting a first internal circuit component to a second internal circuit component of said semiconductor chip.
 29. A semiconductor device, comprising: a semiconductor chip having at least one active surface; a plurality of spaced apart bump sites over said semiconductor chip active surface; wherein each of said bump sites is adapted to direct signals between internal circuitry of said semiconductor chip and at least one external component; and at least one routing trace carried over said active surface in an area unoccupied by said bump sites, said routing trace connecting a first internal circuit component to a second internal circuit component of said semiconductor chip.
 30. A semiconductor device, comprising: a semiconductor chip having at least one active surface; a plurality of spaced apart bump sites over said semiconductor chip active surface; wherein each of said bump sites is adapted to direct signals between internal circuitry of said semiconductor chip and at least one external component; and at least one routing trace carried over an area of said active surface in laterally spaced relationship to said bump sites, said routing trace connecting a first internal circuit component to a second internal circuit component of said semiconductor chip.
 31. A method of forming a semiconductor device, comprising: providing a semiconductor chip having at least one active surface; forming a plurality of spaced apart bump sites over said at least one active surface to direct signals between internal circuitry of said semiconductor chip and at least one external component; and forming at least one routing trace over an area of said at least one active surface unoccupied by said bump sites and laterally spaced therefrom, and positioning said at least one routing trace to connect a first internal circuit component to a laterally remote second internal circuit component of said semiconductor chip.
 32. The method of claim 31, wherein said forming said plurality of spaced apart bump sites and said forming said at least one routing trace occur substantially simultaneously.
 33. A method of forming a semiconductor device, comprising: providing a plurality of laterally adjacent semiconductor chips, each having at least one active surface; forming a plurality of bump sites over said at least one active surface of each of said plurality of laterally adjacent semiconductor chips to direct signals between internal circuitry of each respective semiconductor chip of said plurality of laterally adjacent semiconductor chips and an external component; and forming at least one routing trace over an area of said at least one active surface unoccupied by said bump sites of one of said plurality of laterally adjacent semiconductor chips and laterally spaced from said bump sites thereof, and extending said at least one routing trace to an area of said at least one active surface unoccupied by said plurality of bump sites of another of said plurality of laterally adjacent semiconductor chips to effect an electrical connection between at least one internal circuit component of said one of said plurality of laterally adjacent semiconductor chips and at least one internal circuit component of said another of said plurality of laterally adjacent semiconductor chips.
 34. The method of claim 33, wherein said forming said plurality of bump sites and said forming said at least one routing trace occur substantially simultaneously.
 35. The method of claim 33, further including: providing a carrier having an upper surface with at least one recess therein to receive said plurality of laterally adjacent semiconductor chips, wherein said at least one recess allows substantial alignment of said upper surface of said carrier with said at least one active surface of each of said plurality of laterally adjacent semiconductor chips.
 36. The method of claim 35, further including: disposing a filler material in gaps between walls of said at least one recess and each of said plurality of laterally adjacent semiconductor chips disposed therein.
 37. The method of claim 35, wherein providing said carrier having an upper surface with at least one recess therein comprises providing said carrier with a plurality of recesses.
 38. A method of forming a semiconductor device, comprising: providing a semiconductor chip having at least one active surface; forming a plurality of bump sites over said at least one active surface to direct signals between internal circuitry of said semiconductor chip and at least one external component; forming at least one routing trace including a repair mechanism to extend between two laterally remote circuit portions of said semiconductor chip over an area of said at least one active surface unoccupied by said bump sites and laterally spaced therefrom.
 39. The method of claim 38, wherein said forming said plurality of bump sites and said forming said at least one routing trace occur substantially simultaneously.
 40. The method of claim 39, further including severing said at least one routing trace of said repair mechanism to activate a selected internal circuit in said semiconductor chip.
 41. The method of claim 13, further including severing said at least one routing trace of said repair mechanism to deactivate a selected internal circuit in said semiconductor chip. 